GE IC695CHS012 Universal 12-Slot Backplane Chassis for PACSystems RX3i PLC Automation
GE IC695CHS012 Universal 12-Slot Backplane Chassis for PACSystems RX3i PLC Automation
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Brand:GE Fanuc PLC Item No.:GE IC695CHS012 Product Origin: USA Product Dimensions:457.5×141.5×147.3 mm Product Weight:1.55 kg Payment:T/T, Western Union, Credit Card Goods_stock:15 Shipping Port:Xiamen, China Lead Time:1-3 Days Condition:Brand New And Original Warranty:1 Year Certificate:COO
The GE IC695CHS012 Universal Backplane Chassis is a core structural component engineered for PACSystems RX3i industrial control systems. Serving as the backbone of a modular PLC rack, this 12-slot chassis provides secure mechanical support and reliable electrical connectivity for processors, power supplies, communication interfaces, and I/O modules. Its dual-bus design supports both PCI and high-speed serial modules, enabling flexible system configurations and seamless integration of discrete and analog I/O devices.
Designed for demanding automation environments, the IC695CHS012 simplifies system architecture while maintaining robust performance under continuous operation. Whether deployed in large-scale process control or distributed plant automation, it delivers a dependable physical platform for expanded PLC systems.
Technical Specifications
Specification
Details
Module Type
Universal Backplane Chassis
Platform Compatibility
GE PACSystems RX3i
Number of Slots
12 (supports PCI & serial bus modules)
Supported Module Types
CPU, I/O, Power Supply, Comm Modules
Bus Architecture
Dual bus (PCI + High-Speed Serial)
Orientation
Horizontal rack mounting
Isolation Support
Backplane ground and shielding support
Internal Power Consumption
600 mA @ 3.3 VDC; 240 mA @ 5 VDC
Required Input
+24 V DC external (via chassis TB1 terminal)
Mounting
Panel/Rack mount inside an enclosure
Protection Standard
NEMA/UL Type 1 (IP20) min; higher rating recommended for harsh environments
Operating Temperature
0°C to +60°C
Storage Temperature
−40°C to +85°C
Dimensions (L×W×H)
457.5×141.5×147.3 mm (18.01×5.57×5.80 in)
Weight
Approx. 1.55 kg
Recommended Related Models
GE IC695CPU315 – RX3i CPU Module
GE IC695PWR330 – Power Supply Module
GE IC695BEM331 – Ethernet Communication Module
GE IC695MDL753 – Digital Output Module
GE IC695ALG600 – Universal Analog Input Module
Popular GE PACSystems Modules
GE IC695CPU310 – High-Performance CPU Module
GE IC695ALG608 – Isolated Analog Input Module
GE IC695ALG616 – 16-Channel Analog Input Module
GE IC694PWR321 – Expansion Power Supply
GE IC695ETM001 – Ethernet Transmitter Module
Applications
The IC695CHS012 Universal Backplane Chassis is fundamental to scalable automation systems where complex control logic and a mixture of module types are required:
Centralized process control in manufacturing plants
Distributed I/O systems in utilities and energy infrastructure
Chemical and petrochemical processing automation
Water/wastewater treatment control networks
Large discrete and analog I/O deployments
Its modular design supports hot swap capability for compatible modules, enabling maintenance and upgrades without interrupting system operation.
Advantages
High channel capacity: Accommodates up to 12 modules in one chassis.
Dual-bus flexibility: Supports PCI and serial communication modules.
Hot-swap support: Allows module replacement under power (module-dependent).
Robust design: Engineered for reliable operation in industrial environments.
Efficient airflow: Horizontal orientation enhances natural cooling and reduces risk of thermal stress.
Scalable architecture: Enables large PLC systems with mixed module types without excessive cabinet footprint.
This chassis delivers a strong foundation for high-availability automation systems, reducing downtime and improving engineering flexibility.
Technical FAQs
1. What is the purpose of the IC695CHS012?
It serves as a universal backplane chassis that houses and connects RX3i PLC modules.
2. How many slots does it provide?
It offers 12 slots for CPU, I/O, power, and communication modules.
3. What bus types does it support?
It supports both PCI and high-speed serial buses.
4. Can modules be replaced while the system is running?
Yes, hot-swap support is available for compatible modules.
5. What orientation must it be mounted in?
It must be mounted horizontally to ensure proper airflow and cooling.
6. What external power is required?
A +24 V DC supply is required via the chassis terminal.
7. Does it support legacy modules?
Yes, it supports Series 90-30 and RX3i modules.
8. What is the recommended enclosure protection rating?
At minimum NEMA/UL Type 1 (IP20); higher ratings are recommended for harsh environments.
9. What is the internal power consumption?
It draws 600 mA @ 3.3 VDC and 240 mA @ 5 VDC.
10. What is the physical size of this backplane? 457.5×141.5×147.3 mm overall.
