GE IC695PBM300 PACSystems RX3i Pack Bus Master Module for High-Speed Distributed I/O and System Expansion

Applications

The IC695PBM300 is ideal for distributed control applications where remote I/O networks are critical:

• Factory automation systems with remote I/O racks

• Centralized plant control with segmented field devices

• Machine control installations requiring rapid I/O exchange

• Process automation with geographically distributed sensors and actuators

• Energy and utilities systems with remote monitoring requirements

By extending the reach of PACSystems RX3i I/O via the Pack Bus, this module enables flexible layouts and reduces cabling complexity without sacrificing performance or reliability.

Advantages

• Master control for Pack Bus remote networks — centralizes field I/O management.

• High-speed communications — supports rapid data exchange for real-time control.

• Scalable architecture — simplifies expansion with remote I/O devices.

• Robust diagnostics — link status and error reporting improve system visibility.

• Industrial reliability — built for continuous operation in automation environments.

• Compact design — fits standard backplane slots, preserving panel space.

The IC695PBM300 enhances remote system integration and contributes to efficient distributed control architectures with deterministic performance.

Technical FAQs

1. What is the main function of the IC695PBM300?
It serves as the master controller for Pack Bus remote I/O networks, managing I/O data exchange and communication.

2. Which platform is this module designed for?
It is designed for GE PACSystems RX3i backplane systems.

3. Does it support diagnostics for communication errors?
Yes — it reports link status, communication timeouts, and error conditions.

4. What type of network does it enable?
It enables Pack Bus high-speed remote I/O networks between the central CPU and remote devices.

5. What is the operating temperature range?
Rated for 0°C to +60°C in industrial settings.

6. How is the module powered?
It draws power directly from the RX3i backplane supply rails.

7. Can it support large remote I/O systems?
Yes — it enables scalable distributed I/O deployments.

8. Does it reduce wiring complexity?
Yes — Pack Bus communication reduces the need for extensive discrete wiring.

9. Is configuration done via software?
Yes — setup and network parameters are configured through standard PACSystems programming tools.

10. What industries benefit from this module?
Manufacturing, utilities, process control, energy, and large automated facilities typically use this module for distributed control.