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GE IC695LRE001 Local Remote Enabler Module for PACSystems RX3i Distributed Control and Remote I/O

GE IC695LRE001 Local Remote Enabler Module for PACSystems RX3i Distributed Control and Remote I/O

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Brand:GE Fanuc PLC
Item No.:GE IC695LRE00
Product Origin:USA
Product Dimensions:145×34×140 mm
Product Weight:0.85 kg
Payment:T/T, Western Union, Credit Card
Goods_stock:15
Shipping Port:Xiamen, China
Lead Time:1-3 Days
Condition:Brand New And Original
Warranty:1 Year
Certificate:COO

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IC695LRE001 2

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The GE IC695LRE001 Local Remote Enabler Module is a communication enabler designed for the PACSystems RX3i automation platform. It bridges local PLC logic with remote I/O nodes over a high-speed field bus, enabling efficient distributed control architectures. This module facilitates reliable data exchange between a master controller and remote I/O racks or devices, allowing engineers to design scalable and modular systems that reduce wiring complexity and panel footprint while maintaining high update rates and diagnostic visibility.

Ideal for applications where remote process stations, field-mounted I/O, or geographically distributed controls are needed, the IC695LRE001 supports both discrete and analog data exchange with robust performance and industrial resilience.


Technical Specifications

SpecificationDetails
Module TypeLocal Remote Enabler (Field Bus Interface Module)
Platform CompatibilityGE PACSystems RX3i
Supported I/O ModeRemote I/O communication master/slave
Network InterfaceHigh-speed field bus backplane connection
Local ConnectivityBackplane I/O bus integration
Protocol SupportRemote I/O protocol native to RX3i systems
DiagnosticsLink status, communication timeout, error flags
MountingStandard RX3i backplane slot
Operating Temperature0°C to +60°C
Storage Temperature−40°C to +85°C
Power ConsumptionPowered via backplane rails (standard supply)
Environmental RatingIndustrial automation environments
Dimensions (L×W×H)145×34×140 mm
WeightApprox. 0.85 kg

The IC695LRE001 acts as a communication master or enabler for remote I/O racks, permitting the exchange of input and output data across extended distances without sacrificing performance or reliability.


Recommended Related Models

  • GE IC695CPU320 – High-Performance RX3i CPU Module

  • GE IC695PWR330 – Power Supply Module

  • GE IC695CHS398 – 18-Slot Universal Backplane Chassis

  • GE IC695MDL753 – 32-Point Discrete Output Module

  • GE IC695ALG600 – Universal Analog Input Module


Popular GE PACSystems Modules

  • GE IC695ALG608 – 8-Channel Analog Input Module

  • GE IC695ALG616 – 16-Channel Analog Input Module

  • GE IC695ETM001 – Ethernet Transmit Module

  • GE IC694PWR321 – Expansion Power Supply

  • GE IC695DNM200 – DeviceNet Master Module


Applications

The IC695LRE001 module is particularly effective in distributed control system designs where remote I/O and modular architecture are required:

  • Remote I/O field stations in large plants

  • Distributed control across multiple production lines

  • Factory automation with decentralized I/O expansion

  • Process control systems requiring segmented I/O racks

  • Areas with long cable runs between sensors/actuators and the CPU

It helps centralize control logic while maintaining real-time I/O performance across remote modules.


Advantages

  • Enables distributed I/O architectures — reduces central cabinet size and field wiring.

  • High-speed field bus communication — supports timely data exchange for real-time control.

  • Robust industrial design — built for reliability in automation environments.

  • Integrated diagnostics — simplifies monitoring of remote link and communication status.

  • Flexible integration — works with a wide range of RX3i I/O modules.

  • Scalable system growth — supports control expansions without major redesign.

With the IC695LRE001, engineers can design control systems that span large areas or multiple process zones while maintaining a unified automation strategy.


Technical FAQs

1. What is the role of the IC695LRE001?
It acts as a communication enabler between a PACSystems CPU and remote I/O modules.

2. Which platform does it support?
It is specifically designed for PACSystems RX3i backplane architectures.

3. Does it support both discrete and analog remote I/O?
Yes — it enables distributed communication for both analog and discrete I/O modules.

4. How is the module powered?
It draws its power from the RX3i backplane supply.

5. What is the operating temperature range?
Rated for 0°C to +60°C industrial environments.

6. Does the module offer diagnostics?
Yes — it reports link status and communication errors.

7. What mounting method is required?
It installs in a standard RX3i backplane slot.

8. Is it suitable for long cable runs?
Yes — it is optimized for remote I/O communication over extended field bus distances.

9. Can it be used with multiple remote racks?
Yes — it supports scalable distributed I/O networks.

10. What industries typically use this module?
Large-scale manufacturing, process control, utilities, and automation sectors that require distributed control.


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