The G


E IC670CHS002 is an I/O terminal block designed for GE Field Control and VersaMax-style distributed I/O systems. It serves as a mechanical and electrical mounting base for up to two I/O modules, providing secure field wiring termination, backplane communication routing, and hot-swap module replacement capability.
In industrial automation systems, this component is not a “signal processor” itself, but a critical infrastructure layer that ensures reliable connection between field devices and control modules while minimizing downtime during maintenance.
Technical Specifications
| Parameter | Details |
|---|---|
| Manufacturer | GE Fanuc (GE Intelligent Platforms) |
| Model | IC670CHS002 |
| Series | Field Control / Genius I/O |
| Module Type | I/O Terminal Block / Module Base |
| Module Capacity | Up to 2 I/O modules |
| Wiring Terminals | Up to 37 terminals |
| Wire Compatibility | AWG #14 to #22 copper wire |
| Max Current per Terminal | 10 A |
| Terminal Torque | 4.5 in-lb |
| Isolation Groups | A, B (power), and E (signal isolation) |
| Mounting | DIN rail or chassis-mounted |
| Hot-Swap Support | Yes (module replacement without power-off) |
| Backplane Interface | Integrated I/O communication bus |
| Operating Temperature | -25°C to +85°C |
| Weight | ~0.06–0.2 kg (variant dependent) |
| Dimensions | ~50 × 300 × 250 mm (system dependent) |
The design emphasizes vibration resistance, modular replacement, and wiring safety in high-density industrial control systems.
System Role & Functional Behavior
The IC670CHS002 functions as the structural and electrical foundation of the I/O station:
- Provides mounting base for two independent I/O modules
- Enables secure screw-terminal field wiring connections
- Routes backplane communication between modules and BIU (Bus Interface Unit)
- Allows hot-swapping of I/O modules without disconnecting field wiring
- Organizes power and signal terminals into isolated groups (A, B, E)
- Reduces downtime during maintenance or module replacement
This makes it a key “physical backbone” component in GE distributed control systems.
Recommended Related Modules
The IC670CHS002 is typically used with:
- IC670MDL640 Digital Input Module
- IC670MDL740 Digital Output Module
- IC670ALG230 Analog Input Module
- IC670GBI001 Genius Bus Interface Unit
- IC670PBI001 Power Supply Module
Together, these components form a complete distributed I/O station architecture.
Common GE Field Control Modules
Frequently deployed alongside this base:
- GE PACSystems RX3i I/O racks
- VersaMax I/O expansion modules
- IC693 / IC695 PLC CPU modules
- Genius network communication modules
- Analog and discrete I/O module families
Each layer depends on the CHS002 base for stable field integration.