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ABB DSPC 171 57310001-CC/57310001-CC/8 DS Processor Board

ABB DSPC 171 57310001-CC/57310001-CC/8 DS Processor Board

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Brand:ABB PLC
Item No.:DSPC 171
Product Origin:Sweden (SE)
Product Dimensions:315 x 47 x 250 mm
Product Weight:0.925 kg
Payment:T/T, Western Union, Credit Card
Goods_stock:15
Shipping Port:Xiamen, China
Lead Time:1-3 Days
Condition:Brand New And Original
Warranty:1 Year
Certificate:COO

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Introduction

The ABB DSPC 171 57310001-CC / 57310001-CC/8 DS Processor Board is a high-performance central processing module designed for ABB DS distributed control systems. Engineered for complex industrial environments, it efficiently manages control tasks, real-time data processing, and communication between modules.

Supporting both standard and redundant configurations, this processor board ensures system reliability and high availability. Its robust construction and compatibility with ABB DS memory, I/O, and communication modules make it ideal for demanding industrial applications requiring uninterrupted operation and precise control.


Technical Specifications

FeatureSpecification
Module TypeProcessor Board
ModelDSPC 171 57310001-CC / CC/8
FunctionCentral processing for ABB DS systems
System CompatibilityABB DS distributed control systems
Operating Temperature-20°C to 60°C
MountingRack/Panel mounting
ConnectivityBackplane interface
ConstructionIndustrial-grade design
Dimensions315 × 47 × 250 mm
Weight0.925 kg

Recommended Related Models

  • DSMB 137 — Memory module for storing configuration and operational data

  • DSDX 110 — Digital input/output module for signal management

  • DSAI 110 — Analog input module for process measurement

  • DSAO 110 — Analog output module for precise control

  • DSBC 173 — Communication module for system integration


Popular Related Models

  • DSQC 223 — Digital I/O module for industrial automation

  • DSQC 328A — High-performance I/O module for robotics and control

  • DSMB 138 — Extended memory module for backup and data storage

  • DSDO 115 — Enhanced digital output module

  • DSBC 176 — Communication interface module for distributed systems


Applications

  • Central processing and control for ABB DS distributed control systems

  • Executing complex process automation algorithms and real-time operations

  • Managing communication between I/O, memory, and communication modules

  • Supporting redundant and high-availability system configurations

  • Integration into large-scale industrial process control architectures


Advantages

  • High-Capacity Processing: Handles complex computations and large system data efficiently

  • Variant Compatibility: Supports both CC and CC/8 versions for flexible system deployment

  • Seamless System Integration: Interfaces with ABB DS I/O, memory, and communication modules

  • Industrial-Grade Reliability: Designed to operate in harsh conditions with vibration, electrical noise, and temperature variation

  • Redundancy Ready: Enables fault-tolerant configurations for high system availability

  • Simplified Maintenance: Modular design allows easy replacement and upgrades


Technical FAQs

  1. What is the function of the DSPC 171 processor board?
    It acts as the central processing unit for ABB DS distributed control systems, managing all control and communication tasks.

  2. What is the difference between CC and CC/8 variants?
    CC/8 is a revision with minor hardware or firmware updates while maintaining full compatibility.

  3. Is it suitable for redundant system configurations?
    Yes, it is designed to support high-availability and redundant architectures.

  4. Which modules can it interface with?
    Compatible with ABB DS memory modules, I/O modules, and communication modules.

  5. Does it support real-time control?
    Yes, it provides deterministic, fast, and reliable processing for real-time operations.

  6. Can it be hot-swapped?
    Depending on system design, it may allow module replacement without full system shutdown.

  7. What is the operating temperature range?
    Typically -20°C to 60°C, suitable for industrial environments.

  8. Is it built for harsh industrial conditions?
    Yes, it is engineered to withstand vibration, electrical interference, and temperature variations.

  9. Does it offer diagnostic functionality?
    Yes, LED indicators and system-level diagnostics monitor processor status and faults.

  10. Can it expand system capabilities?
    Yes, it supports integration with additional modules to scale I/O and communication capacity.


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